武汉三工智能装备制造有限公司

无锡SHL2-4000高速半片激光划片裂片机中英文简介

半片全自动激光划片裂片机 

一、设备图片

二、功能 

适用于单晶硅和多晶硅材料太阳电池1/2等分划片和裂片，能够完成自动给料、自动定位划片、自动裂片、小片自动装盒等功能。

三、设备技术参数

四、设备性能特点

1、高超的划片工艺

采用532nm绿光光源，光程固定，光束质量好，激光划线宽度细，热影响区小；电池片切割断面更整齐，对电池片损伤小，切割精准

2、工作效率高

激光划片速度快，整机自动划程度高，设备产能可达3400整片/小时 

3、高精度定位

电池片CCD视觉定位，高精度机器臂取片，定位精度≤0.1mm

4、自动化程度高料盒自动传输

电池片自动上下料、自动定位、自动划片、自动裂片、小片自动装盒。性能稳定，故障率低，维护简单。

SHL2-4000 Half Cell Automatic Laser Scribing&Breaking Machine

Equipment Model

1、Equipment Introduction

Applied to scribe&split mono-crystalline silicon and poly-crystalline silicon solar cell into 1/2 piece, which can achieve automatic cell loading,automatic positioning scribing,automatic cell splitting,small cell load in box automatically and so on.

2、Technology Parameters

3、Equipment Feature

Advanced scribing technology

adopt 532nm green laser,fixed light path,good quality beam,slim laser scribing line,small hot affected area;more uniform solar cell cutting surface,small damage to solar cell,high accuracy cutting.

High working efficiency

High laser scribing speed that could reach to 3400pcs/hr, high automation level

High accuracy positioning

Solar cell CCD visual positioning, high accuracy mechanical arm cell loading, positioning accuracy≤0.1mm

High automation level

Cell basket automatic transfer, solar cell automatic loading and unloading, automatic positioning, automatic scribing, small cell load in box automatically. Stable performance, low failure rate, easy maintenance